Grain Size Distribution at the Bottom Region in Very Narrow Cu Interconnects

Grain size, size-distribution and dislocation structure

Diffraction peak profile analysis (or Line Profile Analysis, LPA) has recently been developed to such an extent that it can be applied as a powerful method for the characterization of microstructures of crystalline materials in terms of crystallite size-distribution and dislocation structures. Physically based theoretical functions and their Fourier coefficients are available for both, the size...

Grain structure analysis and effect on electromigration reliability in nanoscale Cu interconnects

Grain size measurement using distribution classification

The concept of grain size distribution is important in many industrial processes. In this study, rolled chrome concentrate was investigated to find the average grain size. Distribution classification was used with covariance, gray level difference, LBP, Laws and color features. As a comparison cooccurrence features were used. Classification was performed by a distribution classifier using leave...

the u.s. policy in central asia and its impact on the colored revolutions in the region (the case study of tulip revolution in kyrgyzstan)

چکیده ندارد.

Fatal Void Size Comparisons in Via-Below and Via-Above Cu Dual-Damascene Interconnects

The median-times-to-failure (t50’s) for straight dual-damascene via-terminated copper interconnect structures, tested under the same conditions, depend on whether the vias connect down to underlaying leads (metal 2, M2, or via-below structures) or connect up to overlaying leads (metal 1, M1, or via-above structures). Experimental results for a variety of line lengths, widths, and numbers of via...